| الصورة: | رقم جزء الشركة المصنعة | حالة المخزون | السعر | الكمية | ورقة البيانات | Package/Case | Packaging | Series | ProductStatus | Architecture | CoreProcessor | FlashSize | RAMSize | Peripherals | Connectivity | Speed | PrimaryAttributes | OperatingTemperature | 
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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                     | 
				
                    XCZU3EG-1UBVA530IIC SOC CORTEX-A53 530BGA AMD Xilinx |  
                2,340 | - | 
                
                    RFQ | 
                    
                
                  
                    
                 
                     ورقة البيانات  | 
				 
                530-WFBGA, FCBGA | Tray | - | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | -40°C ~ 100°C (TJ) | 
| 
                     
                    
                     | 
				
                    XCZU3CG-2UBVA530IIC SOC CORTEX-A53 530BGA AMD Xilinx |  
                2,368 | - | 
                
                    RFQ | 
                    
                
                  
                    
                 
                     ورقة البيانات  | 
				 
                530-WFBGA, FCBGA | Tray | - | Active | MPU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 1.3GHz | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | -40°C ~ 100°C (TJ) | 
| 
                     
                    
                     | 
				
                    XCZU3EG-2UBVA530IIC SOC CORTEX-A53 530BGA AMD Xilinx |  
                2,820 | - | 
                
                    RFQ | 
                    
                
                  
                    
                 
                     ورقة البيانات  | 
				 
                530-WFBGA, FCBGA | Tray | - | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 1.3GHz | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | -40°C ~ 100°C (TJ) | 
                     
                    
                     
                     
                    
                 | 
				
                    XC7Z045-1FFG900CIC SOC CORTEX-A9 667MHZ 900FCBGA AMD Xilinx |  
                2,995 | - | 
                
                    RFQ | 
                    
                
                  
                    
                 
                     ورقة البيانات  | 
				 
                900-BBGA, FCBGA | Tray | Zynq®-7000 | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Kintex™-7 FPGA, 350K Logic Cells | 0°C ~ 85°C (TJ) | 
                     
                    
                     
                     
                    
                 | 
				
                    SLG7NT41204VGEMINI LAKE RVP Dialog Semiconductor GmbH |  
                2,516 | - | 
                
                    RFQ | 
                    
                
                  
                    
                 
                     ورقة البيانات  | 
				 
                20-UFQFN | Tape & Reel (TR) | - | Active | - | - | - | - | - | - | - | - | -40°C ~ 85°C (TA) | 
                     
                    
                     
                     
                    
                 | 
				
                    BCM58101LB0KFBGLYNX - 100MHZ Broadcom Limited |  
                3,596 | - | 
                
                    RFQ | 
                    
                   - | Bulk | * | Active | - | - | - | - | - | - | - | - | - | |
                     
                    
                     
                     
                    
                 | 
				
                    BCM60321KMLGBCM60321: 200MBPS POWERLINE Broadcom Limited |  
                2,431 | - | 
                
                    RFQ | 
                    
                   - | Tray | * | Active | - | - | - | - | - | - | - | - | - | |
                     
                    
                     
                     
                    
                 | 
				
                    BCM58101B0KFBGLYNX Broadcom Limited |  
                3,366 | - | 
                
                    RFQ | 
                    
                   - | Bulk | * | Active | - | - | - | - | - | - | - | - | - | |
                     
                    
                     
                     
                    
                 | 
				
                    BCM58103B0KFBGLYNX Broadcom Limited |  
                3,536 | - | 
                
                    RFQ | 
                    
                   - | Bulk | * | Active | - | - | - | - | - | - | - | - | - | |
                     
                    
                     
                     
                    
                 | 
				
                    NCN5140STXGKNX WALL SWITCH SYSTEM-IN-PACKAG onsemi |  
                3,585 | - | 
                
                    RFQ | 
                    
                
                  
                    
                 
                     ورقة البيانات  | 
				 
                50-SMD Module | Tape & Reel (TR) | - | Active | MCU | ARM® Cortex®-M0+ | - | - | - | SPI, UART/USART | - | - | -40°C ~ 85°C (TA) | 
                     
                    
                     
                     
                    
                 | 
				
                    NCN5140SGKNX WALL SWITCH SYSTEM-IN-PACKAG onsemi |  
                3,315 | - | 
                
                    RFQ | 
                    
                
                  
                    
                 
                     ورقة البيانات  | 
				 
                50-SMD Module | Tray | - | Active | MCU | ARM® Cortex®-M0+ | - | - | - | SPI, UART/USART | - | - | -40°C ~ 85°C (TA) | 
                     
                    
                     
                     
                    
                 | 
				
                    BCM5892PD0KFBGBCM5892 400MHZ CU WIREBOND Broadcom Limited |  
                3,819 | - | 
                
                    RFQ | 
                    
                   - | Tray | * | Active | - | - | - | - | - | - | - | - | - | |
                     
                    
                     
                     
                    
                 | 
				
                    M2S005-1TQG144IC SOC CORTEX-M3 166MHZ 144TQFP Microchip Technology |  
                3,151 | - | 
                
                    RFQ | 
                    
                
                  
                    
                 
                     ورقة البيانات  | 
				 
                144-LQFP | Tray | SmartFusion®2 | Active | MCU, FPGA | ARM® Cortex®-M3 | 128KB | 64KB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | 166MHz | FPGA - 5K Logic Modules | 0°C ~ 85°C (TJ) | 
                     
                    
                     
                     
                    
                 | 
				
                    M2S005-VF256IC SOC CORTEX-M3 166MHZ 256FBGA Microchip Technology |  
                2,300 | - | 
                
                    RFQ | 
                    
                
                  
                    
                 
                     ورقة البيانات  | 
				 
                256-LFBGA | Tray | SmartFusion®2 | Active | MCU, FPGA | ARM® Cortex®-M3 | 128KB | 64KB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | 166MHz | FPGA - 5K Logic Modules | 0°C ~ 85°C (TJ) | 
                     
                    
                     
                     
                    
                 | 
				
                    M2S005S-TQG144IC SOC CORTEX-M3 166MHZ 144TQFP Microchip Technology |  
                2,044 | - | 
                
                    RFQ | 
                    
                
                  
                    
                 
                     ورقة البيانات  | 
				 
                144-LQFP | Tray | SmartFusion®2 | Active | MCU, FPGA | ARM® Cortex®-M3 | 128KB | 64KB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | 166MHz | FPGA - 5K Logic Modules | 0°C ~ 85°C (TJ) | 
                     
                    
                     
                     
                    
                 | 
				
                    M2S005-VF400IC SOC CORTEX-M3 166MHZ 400VFBGA Microchip Technology |  
                3,323 | - | 
                
                    RFQ | 
                    
                
                  
                    
                 
                     ورقة البيانات  | 
				 
                400-LFBGA | Tray | SmartFusion®2 | Active | MCU, FPGA | ARM® Cortex®-M3 | 128KB | 64KB | DDR | CANbus, Ethernet, I²C, SPI, UART/USART, USB | 166MHz | FPGA - 5K Logic Modules | 0°C ~ 85°C (TJ) | 
                     
                    
                     
                     
                    
                 | 
				
                    M2S005-1TQG144IIC SOC CORTEX-M3 166MHZ 144TQFP Microchip Technology |  
                2,482 | - | 
                
                    RFQ | 
                    
                
                  
                    
                 
                     ورقة البيانات  | 
				 
                144-LQFP | Tray | SmartFusion®2 | Active | MCU, FPGA | ARM® Cortex®-M3 | 128KB | 64KB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | 166MHz | FPGA - 5K Logic Modules | -40°C ~ 100°C (TJ) | 
                     
                    
                     
                     
                    
                 | 
				
                    M2S005-1VF256IC SOC CORTEX-M3 166MHZ 256FBGA Microchip Technology |  
                2,440 | - | 
                
                    RFQ | 
                    
                
                  
                    
                 
                     ورقة البيانات  | 
				 
                256-LFBGA | Tray | SmartFusion®2 | Active | MCU, FPGA | ARM® Cortex®-M3 | 128KB | 64KB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | 166MHz | FPGA - 5K Logic Modules | 0°C ~ 85°C (TJ) | 
                     
                    
                     
                     
                    
                 | 
				
                    M2S005-1VFG256IC SOC CORTEX-M3 166MHZ 256FBGA Microchip Technology |  
                2,754 | - | 
                
                    RFQ | 
                    
                
                  
                    
                 
                     ورقة البيانات  | 
				 
                256-LBGA | Tray | SmartFusion®2 | Active | MCU, FPGA | ARM® Cortex®-M3 | 128KB | 64KB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | 166MHz | FPGA - 5K Logic Modules | 0°C ~ 85°C (TJ) | 
                     
                    
                     
                     
                    
                 | 
				
                    M2S005-VF256IIC SOC CORTEX-M3 166MHZ 256FBGA Microchip Technology |  
                2,450 | - | 
                
                    RFQ | 
                    
                
                  
                    
                 
                     ورقة البيانات  | 
				 
                256-LFBGA | Tray | SmartFusion®2 | Active | MCU, FPGA | ARM® Cortex®-M3 | 128KB | 64KB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | 166MHz | FPGA - 5K Logic Modules | -40°C ~ 100°C (TJ) |