مقابس الدوائر المتكاملة والترانزستورات

رقم جزء الشركة المصنعة	حالة المخزون	السعر	الكمية	ورقة البيانات	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
1109681-628 CONN IC DIP SOCKET 28POS GOLD Aries Electronics	2,131	-	RFQ	ورقة البيانات	Bulk	-	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Through Hole	Spacer	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
1109681-632 CONN IC DIP SOCKET 32POS GOLD Aries Electronics	2,151	-	RFQ	ورقة البيانات	Bulk	-	Active	DIP, 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Through Hole	Spacer	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
1109681-648 CONN IC DIP SOCKET 48POS GOLD Aries Electronics	2,361	-	RFQ	ورقة البيانات	Bulk	-	Active	DIP, 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Through Hole	Spacer	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
257-PGG20012-10 CONN SOCKET PGA GOLD Aries Electronics	2,915	-	RFQ		-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-