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| الصورة: | رقم جزء الشركة المصنعة | حالة المخزون | السعر | الكمية | ورقة البيانات | Packaging | Series | ProductStatus | Type | Composition | Diameter | MeltingPoint | FluxType | WireGauge | MeshType | Process | Form | ShelfLife | ShelfLifeStart |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SMD4300AX10T4SLDR PST WATR SOL 63/37 T4 10CC Chip Quik Inc. |
2,865 | - |
RFQ |
ورقة البيانات |
Syringe | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 4 | Leaded | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture |
|
SMD2020-25000SOLDER SPHERES SN96.5/AG3.0/CU0. Chip Quik Inc. |
2,725 | - |
RFQ |
ورقة البيانات |
Bulk | SMD2 | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.010 (0.25mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture |
|
RASW.020 8OZSOLDER WIRE 63/37 TIN/LEAD ROSIN Chip Quik Inc. |
2,114 | - |
RFQ |
ورقة البيانات |
Bulk | - | Active | Wire Solder | Sn63Pb37 (63/37) | 0.020 (0.51mm) | 361°F (183°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | - | Leaded | Spool, 8 oz (227g), 1/2 lb | - | - |
|
BARSN63PB37SOLDER BAR SN63/PB37 1LB SUPER L Chip Quik Inc. |
2,671 | - |
RFQ |
ورقة البيانات |
Bulk | Super Low Dross™ | Active | Bar Solder | Sn63Pb37 (63/37) | - | 361°F (183°C) | - | - | - | Leaded | Bar, 1 lb (454g) | - | - |
|
SMDSWLF.006 5GSOLDER WIRE SN96.5/AG3/CU0.5 Chip Quik Inc. |
2,163 | - |
RFQ |
ورقة البيانات |
Bulk | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.006 (0.15mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | - | Lead Free | Spool, 0.176 oz (5g) | - | - |
|
SMD2016-25000SOLDER SPHERES SN96.5/AG3.0/CU0. Chip Quik Inc. |
2,586 | - |
RFQ |
ورقة البيانات |
Bulk | SMD2 | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.008 (0.20mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture |
|
SMD3SW.031 4OZSOLDER WIRE 62/36/2 TIN/LEAD/SIL Chip Quik Inc. |
2,589 | - |
RFQ |
ورقة البيانات |
Bulk | SMD3 | Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.031 (0.79mm) | 354°F (179°C) | No-Clean, Water Soluble | - | - | Leaded | Spool, 4 oz (113.40g) | - | - |
|
SMDSWLF.031 4OZSLD WIRE NO-CLEAN 96.5/3/.5 4OZ. Chip Quik Inc. |
2,459 | - |
RFQ |
ورقة البيانات |
Spool | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031 (0.79mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | - | Lead Free | Spool, 4 oz (113.40g) | - | - |
|
SMDSWLF.015 4OZLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
3,066 | - |
RFQ |
ورقة البيانات |
Bulk | SMD | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015 (0.38mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | - | Lead Free | Spool, 4 oz (113.40g) | - | - |
|
SMD3SWLT.040 20GSN42/BI58 2.2% FLUX CORE SOLDER Chip Quik Inc. |
3,185 | - |
RFQ |
ورقة البيانات |
Bulk | SMD3 | Active | Wire Solder | Bi58Sn42 (58/42) | 0.040 (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | - | - | Lead Free | Spool, 0.7 oz (20g) | - | - |
|
SMDSWLT.040 20GSN42/BI57/AG1 2.2 FLUX CORE SOLD Chip Quik Inc. |
3,187 | - |
RFQ |
ورقة البيانات |
Bulk | SMD | Active | Wire Solder | Bi57Sn42Ag1 (57/42/1) | 0.040 (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | 18 AWG, 19 SWG | - | Lead Free | Spool, 0.7 oz (20g) | - | - |
|
BARSN96.5AG3.0CU0.5-8OZSOLDER BAR SN96.5/AG3.0/CU0.5 8O Chip Quik Inc. |
2,603 | - |
RFQ |
ورقة البيانات |
Bulk | Super Low Dross™ | Active | Bar Solder | Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5) | - | 422 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Bar, 0.5 lb (227g) | - | - |
|
SMDSWLF.006 10GSOLDER WIRE SN96.5/AG3/CU0.5 Chip Quik Inc. |
2,262 | - |
RFQ |
ورقة البيانات |
Bulk | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.006 (0.15mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | - | Lead Free | Spool, 0.35 oz (10g) | - | - |
|
RASW.020 1LBSOLDER WIRE 63/37 TIN/LEAD ROSIN Chip Quik Inc. |
3,667 | - |
RFQ |
ورقة البيانات |
Bulk | - | Active | Wire Solder | Sn63Pb37 (63/37) | 0.020 (0.51mm) | 361°F (183°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
SMD2SWLF.012 100GLF SOLDER WIRE 99.3/0.7 TIN/COPP Chip Quik Inc. |
2,745 | - |
RFQ |
ورقة البيانات |
Bulk | SMD2 | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.012 (0.31mm) | 441°F (227°C) | No-Clean, Water Soluble | 28 AWG, 30 SWG | - | Lead Free | Spool, 3.53 oz (100g) | - | - |
|
BARSN99.3CU0.7SOLDER BAR SN99.3/CU0.7 1LB SUPE Chip Quik Inc. |
2,722 | - |
RFQ |
ورقة البيانات |
Bulk | Super Low Dross™ | Active | Bar Solder | Sn99.3Cu0.7 (99.3/0.7) | - | 441°F (227°C) | - | - | - | Lead Free | Bar, 1 lb (454g) | - | - |
|
SMD291AX250T4SLDR PST NO-CLEAN 63/37 T4 250G Chip Quik Inc. |
3,165 | - |
RFQ |
ورقة البيانات |
Jar | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture |
|
SMD4300AX250T4SLDR PST WATR SOL 63/37 T4 250G Chip Quik Inc. |
2,161 | - |
RFQ |
ورقة البيانات |
Jar | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 4 | Leaded | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture |
|
SMD291SNL250T4SLDR PST NO-CLEAN SAC305 T4 250G Chip Quik Inc. |
2,009 | - |
RFQ |
ورقة البيانات |
Jar | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture |
|
SMD4300SNL250T4SLDR PST WATR SOL SAC305 T4 250G Chip Quik Inc. |
2,526 | - |
RFQ |
ورقة البيانات |
Jar | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | Water Soluble | - | 4 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture |
- 1500+ متوسط RFQ اليومي
- 20,000.000 وحدة المنتج القياسية
- 1800+ المصنعين حول العالم
- 15,000+ المخزن المتاح
