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| الصورة: | رقم جزء الشركة المصنعة | حالة المخزون | السعر | الكمية | ورقة البيانات | Packaging | Series | ProductStatus | Type | Composition | Diameter | MeltingPoint | FluxType | WireGauge | MeshType | Process | Form | ShelfLife | ShelfLifeStart |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
17553SOLDER 1.2MM 100G Aven Tools |
3,357 | - |
RFQ |
ورقة البيانات |
Spool | - | Active | Wire Solder | Sn60Pb40 (60/40) | 0.047 (1.19mm) | 360°F (180°C) | Rosin Activated (RA) | 17 AWG, 18 SWG | - | Leaded | Spool, 3.53 oz (100g) | - | - |
|
SMD3SW.031 1OZSOLDER WIRE 62/36/2 TIN/LEAD/SIL Chip Quik Inc. |
2,475 | - |
RFQ |
ورقة البيانات |
Bulk | SMD3 | Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.031 (0.79mm) | 354°F (179°C) | No-Clean, Water Soluble | - | - | Leaded | Spool, 1 oz (28.35g) | - | - |
|
SMD3SW.020 1OZSOLDER WIRE 62/36/2 TIN/LEAD/SIL Chip Quik Inc. |
2,771 | - |
RFQ |
ورقة البيانات |
Bulk | SMD3 | Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.020 (0.51mm) | 354°F (179°C) | No-Clean, Water Soluble | - | - | Leaded | Spool, 1 oz (28.35g) | - | - |
|
WBNCC633720NO-CLEAN FLUX CORE SOLDER, 63/37 SRA Soldering Products |
3,240 | - |
RFQ |
ورقة البيانات |
Spool | - | Active | Wire Solder | Sn63Pb37 (63/37) | 0.020 (0.51mm) | 361°F (183°C) | No-Clean | 24 AWG, 25 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
SMDAG100-S-0.25SOLDER SHOT AG100 0.25OZ 7G Chip Quik Inc. |
3,784 | - |
RFQ |
ورقة البيانات |
Bulk | SMD | Active | Solder Shot | Ag100(100) | - | 1762°F (961°C) | - | - | - | Lead Free | Bag, 0.25 oz (7g) | - | - |
|
SMD2SWLF.020 2OZLF SOLDER WIRE 99.3/0.7 TIN/COPP Chip Quik Inc. |
3,178 | - |
RFQ |
ورقة البيانات |
Bulk | SMD2 | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.020 (0.51mm) | 441°F (227°C) | No-Clean, Water Soluble | - | - | Lead Free | Spool, 2 oz (56.70g) | - | - |
|
SMD2SWLF.015 2OZLF SOLDER WIRE 99.3/0.7 TIN/COPP Chip Quik Inc. |
2,502 | - |
RFQ |
ورقة البيانات |
Bulk | SMD2 | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.015 (0.38mm) | 441°F (227°C) | No-Clean, Water Soluble | - | - | Lead Free | Spool, 2 oz (56.70g) | - | - |
|
24-6337-9715SOLDER FLUX-CORED/285 63/37 .050 Kester Solder |
3,381 | - |
RFQ |
ورقة البيانات |
Bulk | 285 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.050 (1.27mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 16 AWG, 18 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
CQ100GE 250GGERMANIUM DOPED SOLDER PASTE NO- Chip Quik Inc. |
2,489 | - |
RFQ |
ورقة البيانات |
Bulk | - | Active | Solder Paste | Sn99.244Cu0.7 (Ni0.05/Ge0.006) | - | 441°F (227°C) | No-Clean | - | 4 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture |
|
SMD3SW.031 2OZSOLDER WIRE 62/36/2 TIN/LEAD/SIL Chip Quik Inc. |
2,972 | - |
RFQ |
ورقة البيانات |
Bulk | SMD3 | Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.031 (0.79mm) | 354°F (179°C) | No-Clean, Water Soluble | - | - | Leaded | Spool, 2 oz (56.70g) | - | - |
|
SMD3SW.031 1LBSOLDER WIRE 62/36/2 TIN/LEAD/SIL Chip Quik Inc. |
2,209 | - |
RFQ |
ورقة البيانات |
Bulk | SMD3 | Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.031 (0.79mm) | 354°F (179°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
NC3SW.020 1LBSOLDER WIRE 62/36/2 TIN/LEAD/SIL Chip Quik Inc. |
2,133 | - |
RFQ |
ورقة البيانات |
Bulk | - | Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.020 (0.51mm) | 354°F (179°C) | No-Clean | 24 AWG, 25 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
SMD3SW.020 1LBSOLDER WIRE 62/36/2 TIN/LEAD/SIL Chip Quik Inc. |
3,693 | - |
RFQ |
ورقة البيانات |
Bulk | SMD3 | Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.020 (0.51mm) | 354°F (179°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
SMD2200SOLDER SPHERES 63/37 .024 DIAM Chip Quik Inc. |
3,199 | - |
RFQ |
ورقة البيانات |
Bulk | SMD2 | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.024 (0.61mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture |
|
NC3SWLF.020 1LBLF SOLDER WIRE 96.5/3.5 TIN/SILV Chip Quik Inc. |
3,841 | - |
RFQ |
ورقة البيانات |
Bulk | - | Active | Wire Solder | Sn96.5Ag3.5 (96.5/3.5) | 0.020 (0.51mm) | 430°F (221°C) | No-Clean | 24 AWG, 25 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - |
|
SMDCU100-S-16SOLDER SHOT CU100 16OZ 454G Chip Quik Inc. |
2,385 | - |
RFQ |
ورقة البيانات |
Bulk | SMD | Active | Solder Shot | Cu100(100) | - | 1983°F (1084°C) | - | - | - | Lead Free | Bag, 1 lb (454g) | - | - |
|
NCSWLF.020 1LBLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
3,327 | - |
RFQ |
ورقة البيانات |
Bulk | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020 (0.51mm) | 422 ~ 428°F (217 ~ 220°C) | No-Clean | 24 AWG, 25 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - |
|
SMD2SWLF.031 4OZLF SOLDER WIRE 99.3/0.7 TIN/COPP Chip Quik Inc. |
3,716 | - |
RFQ |
ورقة البيانات |
Bulk | SMD2 | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.031 (0.79mm) | 441°F (227°C) | No-Clean, Water Soluble | - | - | Lead Free | Spool, 4 oz (113.40g) | - | - |
|
SMDSWLF.015 1LBLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
3,595 | - |
RFQ |
ورقة البيانات |
Bulk | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015 (0.38mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 27 AWG, 28 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - |
|
SMD2SWLF.015 4OZLF SOLDER WIRE 99.3/0.7 TIN/COPP Chip Quik Inc. |
2,378 | - |
RFQ |
ورقة البيانات |
Bulk | SMD2 | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.015 (0.38mm) | 441°F (227°C) | No-Clean, Water Soluble | - | - | Lead Free | Spool, 4 oz (113.40g) | - | - |
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