لحام

الصورة: رقم جزء الشركة المصنعة حالة المخزون السعر الكمية ورقة البيانات Packaging Series ProductStatus Type Composition Diameter MeltingPoint FluxType WireGauge MeshType Process Form ShelfLife ShelfLifeStart
SMD2SWLT.047 1OZ

SMD2SWLT.047 1OZ

SOLDER WIRE SN42/BI57.6/AG0.4 .0

Chip Quik Inc.
3,490 -

RFQ

SMD2SWLT.047 1OZ

ورقة البيانات

Bulk SMD2 Active Wire Solder Bi57.6Sn42Ag0.4 (57.6/42/0.4) 0.047 (1.19mm) 280°F (138°C) - - - Lead Free Spool, 1 oz (28.35g) - -
NC191LTA15T5

NC191LTA15T5

SMOOTH FLOW LOW TEMP SOLDER PAST

Chip Quik Inc.
2,240 -

RFQ

NC191LTA15T5

ورقة البيانات

Bulk Smooth Flow™ Active Solder Paste Bi57Sn42Ag1 (57/42/1) - 279°F (137°C) No-Clean - 5 - Syringe, 0.53 oz (15g), 5cc 12 Months Date of Manufacture
SMD291SNL

SMD291SNL

SOLDER PASTE NO-CLEAN LF 5CC SYR

Chip Quik Inc.
2,893 -

RFQ

SMD291SNL

ورقة البيانات

Syringe - Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) No-Clean - 3 Lead Free Syringe, 0.53 oz (15g), 5cc 6 Months Date of Manufacture
SMDSWLT.047 1OZ

SMDSWLT.047 1OZ

SOLDER WIRE SN42/BI57/AG1 .047

Chip Quik Inc.
3,561 -

RFQ

SMDSWLT.047 1OZ

ورقة البيانات

Bulk SMD Active Wire Solder Bi57Sn42Ag1 (57/42/1) 0.047 (1.19mm) 280°F (138°C) - - - Lead Free Spool, 1 oz (28.35g) - -
TS391SNL

TS391SNL

THERMALLY STABLE SOLDER PASTE NO

Chip Quik Inc.
2,833 -

RFQ

TS391SNL

ورقة البيانات

Bulk - Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) No-Clean - 4 Lead Free Syringe, 0.53 oz (15g), 5cc 12 Months Date of Manufacture
TS391SNL50

TS391SNL50

THERMALLY STABLE SOLDER PASTE NO

Chip Quik Inc.
2,361 -

RFQ

TS391SNL50

ورقة البيانات

Bulk - Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) No-Clean - 4 Lead Free Jar, 1.76 oz (50g) 12 Months Date of Manufacture
NC191LTA50

NC191LTA50

SMOOTH FLOW LOW TEMP SOLDER PAST

Chip Quik Inc.
2,830 -

RFQ

NC191LTA50

ورقة البيانات

Bulk Smooth Flow™ Active Solder Paste Bi57Sn42Ag1 (57/42/1) - 279°F (137°C) No-Clean - 4 - Jar, 1.76 oz (50g) 12 Months Date of Manufacture
TS391LT50

TS391LT50

THERMALLY STABLE SOLDER PASTE NO

Chip Quik Inc.
2,510 -

RFQ

TS391LT50

ورقة البيانات

Bulk - Active Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) - 281°F (138°C) No-Clean - 4 Lead Free Jar, 1.76 oz (50g) 12 Months Date of Manufacture
SMD2050-25000

SMD2050-25000

SOLDER SPHERES SAC305 .024 DIAM

Chip Quik Inc.
2,054 -

RFQ

SMD2050-25000

ورقة البيانات

Jar SMD2 Active Solder Sphere Sn96.5Ag3Cu0.5 (96.5/3/0.5) 0.024 (0.61mm) 423 ~ 428°F (217 ~ 220°C) - - - Lead Free Jar 24 Months Date of Manufacture
TS391AX10

TS391AX10

THERMALLY STABLE SOLDER PASTE NO

Chip Quik Inc.
2,639 -

RFQ

TS391AX10

ورقة البيانات

Bulk - Active Solder Paste Sn63Pb37 (63/37) - 361°F (183°C) No-Clean - 4 Leaded Syringe, 1.23 oz (35g), 10cc 12 Months Date of Manufacture
TS391LT10

TS391LT10

THERMALLY STABLE SOLDER PASTE NO

Chip Quik Inc.
2,648 -

RFQ

TS391LT10

ورقة البيانات

Bulk - Active Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) - 281°F (138°C) No-Clean - 4 Lead Free Syringe, 1.23 oz (35g), 10cc 12 Months Date of Manufacture
SMD4300AX10T5

SMD4300AX10T5

SOLDER PASTE WATER SOL T5 10CC

Chip Quik Inc.
2,740 -

RFQ

SMD4300AX10T5

ورقة البيانات

Syringe - Active Solder Paste Sn63Pb37 (63/37) - 361°F (183°C) Water Soluble - 5 Leaded Syringe, 1.23 oz (35g), 10cc 12 Months Date of Manufacture
TS391SNL10

TS391SNL10

THERMALLY STABLE SOLDER PASTE NO

Chip Quik Inc.
3,131 -

RFQ

TS391SNL10

ورقة البيانات

Bulk - Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) No-Clean - 4 Lead Free Syringe, 1.23 oz (35g), 10cc 12 Months Date of Manufacture
SMD4300SNL10T5

SMD4300SNL10T5

SLD PASTE LF WATER SOL T5 10CC

Chip Quik Inc.
3,737 -

RFQ

SMD4300SNL10T5

ورقة البيانات

Syringe - Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) Water Soluble - 5 Lead Free Syringe, 1.23 oz (35g), 10cc 6 Months Date of Manufacture
SMD2SWLF.015 8OZ

SMD2SWLF.015 8OZ

LF SOLDER WIRE 99.3/0.7 TIN/COPP

Chip Quik Inc.
3,581 -

RFQ

SMD2SWLF.015 8OZ

ورقة البيانات

Bulk SMD2 Active Wire Solder Sn99.3Cu0.7 (99.3/0.7) 0.015 (0.38mm) 441°F (227°C) No-Clean, Water Soluble 27 AWG, 28 SWG - Lead Free Spool, 8 oz (227g), 1/2 lb - -
TS991AX35T4

TS991AX35T4

THERMALLY STABLE SOLDER PASTE NC

Chip Quik Inc.
3,310 -

RFQ

TS991AX35T4

ورقة البيانات

Bulk CHIPQUIK® Active Solder Paste Sn63Pb37 (63/37) - 361°F (183°C) No-Clean - 4 Leaded Syringe, 1.23 oz (34.869g) 12 Months Date of Manufacture
SMD4300AX250T3

SMD4300AX250T3

SOLDER PASTE SN63/PB37 250G

Chip Quik Inc.
2,538 -

RFQ

SMD4300AX250T3

ورقة البيانات

Jar - Active Solder Paste Sn63Pb37 (63/37) - 361°F (183°C) Water Soluble - 3 Leaded Jar, 8.8 oz (250g) 12 Months Date of Manufacture
SMD3SW.031 8OZ

SMD3SW.031 8OZ

SOLDER WIRE 62/36/2 TIN/LEAD/SIL

Chip Quik Inc.
2,124 -

RFQ

SMD3SW.031 8OZ

ورقة البيانات

Bulk SMD3 Active Wire Solder Sn62Pb36Ag2 (62/36/2) 0.031 (0.79mm) 354°F (179°C) No-Clean, Water Soluble 20 AWG, 22 SWG - Leaded Spool, 8 oz (227g), 1/2 lb - -
SMD291SNLT6

SMD291SNLT6

SOLDER PASTE NO CLEAN LEAD-FREE

Chip Quik Inc.
3,020 -

RFQ

SMD291SNLT6

ورقة البيانات

Bulk SMD Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 422 ~ 428°F (217 ~ 220°C) No-Clean - 6 Lead Free Syringe, 0.53 oz (15g), 5cc 6 Months Date of Manufacture
TS391AX250

TS391AX250

THERMALLY STABLE SOLDER PASTE NO

Chip Quik Inc.
3,254 -

RFQ

TS391AX250

ورقة البيانات

Bulk - Active Solder Paste Sn63Pb37 (63/37) - 361°F (183°C) No-Clean - 4 Leaded Jar, 8.8 oz (250g) 12 Months Date of Manufacture
Total 420 Record«Prev1... 910111213141516...21Next»
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1500+ متوسط RFQ اليومي
20,000.000
20,000.000 وحدة المنتج القياسية
1800+
1800+ المصنعين حول العالم
15,000+
15,000+ المخزن المتاح
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