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| الصورة: | رقم جزء الشركة المصنعة | حالة المخزون | السعر | الكمية | ورقة البيانات | Packaging | Series | ProductStatus | Type | Composition | Diameter | MeltingPoint | FluxType | WireGauge | MeshType | Process | Form | ShelfLife | ShelfLifeStart |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SMD4300SNL250T3SOLDER PASTE SAC305 250G T3 Chip Quik Inc. |
3,778 | - |
RFQ |
ورقة البيانات |
Jar | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | Water Soluble | - | 3 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture |
|
CQ100GE.031 1LBGERMANIUM DOPED SOLDER WIRE SN/C Chip Quik Inc. |
3,093 | - |
RFQ |
ورقة البيانات |
Bulk | - | Active | Wire Solder | Sn99.244Cu0.7 (Ni0.05/Ge0.006) | 0.031 (0.79mm) | 441°F (227°C) | No-Clean | - | - | Lead Free | Spool, 1 lb (454 g) | - | - |
|
SMD2SWLF.020 1LBLF SOLDER WIRE 99.3/0.7 TIN/COPP Chip Quik Inc. |
2,652 | - |
RFQ |
ورقة البيانات |
Bulk | SMD2 | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.020 (0.51mm) | 441°F (227°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - |
|
SMD2SWLF.015 1LBLF SOLDER WIRE 99.3/0.7 TIN/COPP Chip Quik Inc. |
3,994 | - |
RFQ |
ورقة البيانات |
Bulk | SMD2 | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.015 (0.38mm) | 441°F (227°C) | No-Clean, Water Soluble | 27 AWG, 28 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - |
|
SMD291SNLT7SOLDER PASTE NO CLEAN LEAD-FREE Chip Quik Inc. |
2,837 | - |
RFQ |
ورقة البيانات |
Bulk | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 7 | - | Syringe, 0.35 oz (10g), 5cc | 6 Months | Date of Manufacture |
|
SMD4300AX250T5SOLDER PASTE SN63/PB37 250G T5 Chip Quik Inc. |
3,486 | - |
RFQ |
ورقة البيانات |
Jar | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 5 | Leaded | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture |
|
RASW.020 1OZSOLDER WIRE 63/37 TIN/LEAD ROSIN Chip Quik Inc. |
3,932 | - |
RFQ |
ورقة البيانات |
Bulk | - | Active | Wire Solder | Sn63Pb37 (63/37) | 0.020 (0.51mm) | 361°F (183°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | - | Leaded | Spool, 1 oz (28.35g) | - | - |
|
SMD291SNL250T5SOLDER PASTE SAC305 250G T5 Chip Quik Inc. |
2,225 | - |
RFQ |
ورقة البيانات |
Jar | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 5 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture |
|
RASW.031 2OZSOLDER WIRE 63/37 TIN/LEAD ROSIN Chip Quik Inc. |
2,370 | - |
RFQ |
ورقة البيانات |
Bulk | - | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031 (0.79mm) | 361°F (183°C) | Rosin Activated (RA) | 21 AWG, 20 SWG | - | Leaded | Spool, 2 oz (56.70g) | - | - |
|
RASW.020 2OZSOLDER WIRE 63/37 TIN/LEAD ROSIN Chip Quik Inc. |
3,732 | - |
RFQ |
ورقة البيانات |
Bulk | - | Active | Wire Solder | Sn63Pb37 (63/37) | 0.020 (0.51mm) | 361°F (183°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | - | Leaded | Spool, 2 oz (56.70g) | - | - |
|
RASWLF.031 1OZLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
3,454 | - |
RFQ |
ورقة البيانات |
Bulk | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031 (0.79mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 21 AWG, 20 SWG | - | Lead Free | Spool, 1 oz (28.35g) | - | - |
|
RASWLF.020 1OZLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
3,040 | - |
RFQ |
ورقة البيانات |
Bulk | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020 (0.51mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | - | Lead Free | Spool, 1 oz (28.35g) | - | - |
|
SMD2SW.020 1OZSOLDER WIRE 60/40 TIN/LEAD NO-CL Chip Quik Inc. |
3,273 | - |
RFQ |
ورقة البيانات |
Bulk | SMD2 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.020 (0.51mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean, Water Soluble | - | - | Leaded | Spool, 1 oz (28.35g) | - | - |
|
SMDSW.031 1OZSOLDER WIRE NO-CLEAN 63/37 1OZ. Chip Quik Inc. |
2,208 | - |
RFQ |
ورقة البيانات |
Spool | - | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031 (0.79mm) | 361°F (183°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | - | Leaded | Spool, 1 oz (28.35g) | - | - |
|
SMDSW.020 1OZSOLDER WIRE NO-CLEAN 63/37 1OZ. Chip Quik Inc. |
3,594 | - |
RFQ |
ورقة البيانات |
Spool | - | Active | Wire Solder | Sn63Pb37 (63/37) | 0.020 (0.51mm) | 361°F (183°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | - | Leaded | Spool, 1 oz (28.35g) | - | - |
|
NC191LT10SMOOTH FLOW LOW TEMP SOLDER PAST Chip Quik Inc. |
3,605 | - |
RFQ |
ورقة البيانات |
Bulk | Smooth Flow™ | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 280°F (138°C) | No-Clean | - | 4 | Lead Free | Syringe, 0.35 oz (10g), 5cc | 6 Months | Date of Manufacture |
|
RASWLF.015 1OZLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
2,189 | - |
RFQ |
ورقة البيانات |
Bulk | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015 (0.38mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 27 AWG, 28 SWG | - | Lead Free | Spool, 1 oz (28.35g) | - | - |
|
SMDSW.020 2OZSOLDER WIRE NO-CLEAN 63/37 2OZ. Chip Quik Inc. |
3,215 | - |
RFQ |
ورقة البيانات |
Spool | - | Active | Wire Solder | Sn63Pb37 (63/37) | 0.020 (0.51mm) | 361°F (183°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | - | Leaded | Spool, 2 oz (56.70g) | - | - |
|
RASW.020 4OZSOLDER WIRE 63/37 TIN/LEAD ROSIN Chip Quik Inc. |
3,452 | - |
RFQ |
ورقة البيانات |
Bulk | - | Active | Wire Solder | Sn63Pb37 (63/37) | 0.020 (0.51mm) | 361°F (183°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | - | Leaded | Spool, 4 oz (113.40g) | - | - |
|
NC191LT15SMOOTH FLOW LOW TEMP SOLDER PAST Chip Quik Inc. |
3,293 | - |
RFQ |
ورقة البيانات |
Bulk | Smooth Flow™ | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 280°F (138°C) | No-Clean | - | 4 | Lead Free | Syringe, 0.53 oz (15g), 5cc | 6 Months | Date of Manufacture |
- 1500+ متوسط RFQ اليومي
- 20,000.000 وحدة المنتج القياسية
- 1800+ المصنعين حول العالم
- 15,000+ المخزن المتاح
