المزيد من فئات المنتجات

مقابس الدوائر المتكاملة والترانزستورات

رقم جزء الشركة المصنعة	حالة المخزون	السعر	الكمية	ورقة البيانات	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
69802-432LF CONN SOCKET PLCC 32POS TIN Amphenol ICC (FCI)	4,424	-	RFQ	ورقة البيانات	Tape & Reel (TR),Cut Tape (CT)	-	Active	PLCC	32 (2 x 7, 2 x 9)	0.050 (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050 (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Polyphenylene Sulfide (PPS)
ICM-642-1-GT-HT MACHINE PIN SOCKET, IC, DIP, 42P Adam Tech	1,083	-	RFQ	ورقة البيانات	Tube	ICM	Active	DIP, 0.6 (15.24mm) Row Spacing	42 (2 x 21)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Beryllium Copper	Polyphenylene Sulfide (PPS)
PLCC-28-AT PLCC 28P THROUGH HOLE Adam Tech	2,226	-	RFQ	ورقة البيانات	Tube	PLCC	Active	PLCC	28 (4 x 7)	0.050 (1.27mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
SA283000 CONN IC DIP SOCKET 28POS TIN On Shore Technology Inc.	1,184	-	RFQ	ورقة البيانات	Tube	SA	Active	DIP, 0.3 (7.62mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Tin	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Thermoplastic, Polyester, Glass Filled
115-43-308-41-003000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	934	-	RFQ	ورقة البيانات	Tube	115	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
8428-21B1-RK-TR CONN SOCKET PLCC 28POS TIN 3M	3,436	-	RFQ	ورقة البيانات	Tape & Reel (TR),Cut Tape (CT)	8400	Active	PLCC	28 (4 x 7)	0.050 (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Surface Mount	Closed Frame	Solder	0.050 (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Polybutylene Terephthalate (PBT), Glass Filled
DILB40P-223TLF CONN IC DIP SOCKET 40POS TIN Amphenol ICC (FCI)	13,916	-	RFQ	ورقة البيانات	Tube	-	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Tin	100.0µin (2.54µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	100.0µin (2.54µm)	Copper Alloy	Polyamide (PA), Nylon
PLCC-44-AT PLCC 44P THROUGH HOLE Adam Tech	2,349	-	RFQ	ورقة البيانات	Tube	PLCC	Active	PLCC	44 (4 x 11)	0.050 (1.27mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
A-CCS 032-Z-T CONN SOCKET PLCC 32POS TIN Assmann WSW Components	2,499	-	RFQ	ورقة البيانات	Tube	-	Active	PLCC	32 (2 x 7, 2 x 9)	0.050 (1.27mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT)
4848-6004-CP CONN IC DIP SOCKET 48POS TIN 3M	1,694	-	RFQ	ورقة البيانات	Tube	4800	Active	DIP, 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Tin	35.4µin (0.90µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	35.0µin (0.90µm)	Phosphor Bronze	Polyester, Glass Filled
4848-6000-CP CONN IC DIP SOCKET 48POS TIN 3M	1,190	-	RFQ	ورقة البيانات	Tube	4800	Active	DIP, 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Tin	35.4µin (0.90µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	35.0µin (0.90µm)	Phosphor Bronze	Polyester, Glass Filled
SA286040 CONN IC DIP SOCKET 28POS GOLD On Shore Technology Inc.	1,704	-	RFQ	ورقة البيانات	Tube	SA	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	80.0µin (2.03µm)	Brass	Thermoplastic, Polyester, Glass Filled
14-3518-10 CONN IC DIP SOCKET 14POS GOLD Aries Electronics	1,116	-	RFQ	ورقة البيانات	Bulk	518	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
111-43-308-41-001000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	2,779	-	RFQ	ورقة البيانات	Tube	111	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
69802-132LF CONN SOCKET PLCC 32POS TIN Amphenol ICC (FCI)	7,911	-	RFQ	ورقة البيانات	Tube	-	Active	PLCC	32 (2 x 7, 2 x 9)	0.050 (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050 (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Polyphenylene Sulfide (PPS)
69802-032LF CONN SOCKET PLCC 32POS TIN Amphenol ICC (FCI)	4,696	-	RFQ	ورقة البيانات	Tube	-	Active	PLCC	32 (2 x 7, 2 x 9)	0.050 (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050 (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Polyphenylene Sulfide (PPS)
110-41-316-41-001000 CONN IC DIP SOCKET 16POS GOLD Mill-Max Manufacturing Corp.	1,380	-	RFQ	ورقة البيانات	Tube	110	Active	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
8420-21B1-RK-TP CONN SOCKET PLCC 20POS TIN 3M	3,667	-	RFQ	ورقة البيانات	Tube	8400	Active	PLCC	20 (4 x 5)	0.050 (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Surface Mount	Closed Frame	Solder	0.100 (2.54mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Polybutylene Terephthalate (PBT), Glass Filled
110-87-324-41-001101 CONN IC DIP SOCKET 24POS GOLD Preci-Dip	1,052	-	RFQ	ورقة البيانات	Tube	110	Active	DIP, 0.3 (7.62mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
AR 32-HZL/01-TT CONN IC DIP SOCKET 32POS GOLD Assmann WSW Components	7,945	-	RFQ	ورقة البيانات	Tube	-	Active	DIP, 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester