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| الصورة: | رقم جزء الشركة المصنعة | حالة المخزون | السعر | الكمية | ورقة البيانات | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
20-3518-10CONN IC DIP SOCKET 20POS GOLD Aries Electronics |
3,690 | - |
RFQ |
ورقة البيانات |
Tube | 518 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
A-CCS 068-Z-TCONN SOCKET PLCC 68POS TIN Assmann WSW Components |
6,819 | - |
RFQ |
ورقة البيانات |
Tube | - | Active | PLCC | 68 (4 x 17) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT) |
|
111-43-314-41-001000CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp. |
8,104 | - |
RFQ |
ورقة البيانات |
Tube | 111 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
210-1-28-006CONN IC DIP SOCKET 28POS GOLD CNC Tech |
1,555 | - |
RFQ |
ورقة البيانات |
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
940-44-032-24-000000CONN SOCKET PLCC 32POS TIN Mill-Max Manufacturing Corp. |
4,426 | - |
RFQ |
ورقة البيانات |
Tube | 940 | Active | PLCC | 32 (2 x 7, 2 x 9) | 0.100 (2.54mm) | Tin | 150.0µin (3.81µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
AR 40-HZL-TTCONN IC DIP SOCKET 40POS TIN Assmann WSW Components |
8,409 | - |
RFQ |
ورقة البيانات |
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
1-1814655-1CONN SOCKET SIP 16POS GOLD TE Connectivity AMP Connectors |
4,371 | - |
RFQ |
ورقة البيانات |
Bulk | - | Active | SIP | 16 (1 x 16) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Thermoplastic, Polyester |
|
8444-21B1-RK-TPCONN SOCKET PLCC 44POS TIN 3M |
3,496 | - |
RFQ |
ورقة البيانات |
Tube | 8400 | Active | PLCC | 44 (4 x 11) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled |
|
940-44-028-24-000000CONN SOCKET PLCC 28POS TIN Mill-Max Manufacturing Corp. |
2,544 | - |
RFQ |
ورقة البيانات |
Tube | 940 | Active | PLCC | 28 (4 x 7) | 0.100 (2.54mm) | Tin | 150.0µin (3.81µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
AR 20-HZW/TNCONN IC DIP SOCKET 20POS GOLD Assmann WSW Components |
3,167 | - |
RFQ |
ورقة البيانات |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
4601CONN TRANSIST TO-3 3POS TIN Keystone Electronics |
2,207 | - |
RFQ |
ورقة البيانات |
Bulk | - | Active | Transistor, TO-3 | 3 (Oval) | - | Tin | - | Brass | Chassis Mount | Closed Frame | Solder | - | Tin | - | Brass | Polyester, Glass Filled |
|
18-3518-10CONN IC DIP SOCKET 18POS GOLD Aries Electronics |
1,152 | - |
RFQ |
ورقة البيانات |
Bulk | 518 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
A-CCS 084-Z-TIC PLCC SOCKET 84POS TIN Assmann WSW Components |
1,646 | - |
RFQ |
ورقة البيانات |
Tube | - | Active | PLCC | 84 (4 x 21) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT) |
|
8452-21B1-RK-TPCONN SOCKET PLCC 52POS TIN 3M |
1,113 | - |
RFQ |
ورقة البيانات |
Tube | 8400 | Active | PLCC | 52 (4 x 13) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled |
|
A-CCS 032-G-TCONN SOCKET PLCC 32POS GOLD Assmann WSW Components |
1,480 | - |
RFQ |
ورقة البيانات |
Tube | - | Active | PLCC | 32 (2 x 7, 2 x 9) | 0.050 (1.27mm) | Gold | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Phosphor Bronze | Polybutylene Terephthalate (PBT) |
|
8468-21B1-RK-TRCONN SOCKET PLCC 68POS TIN 3M |
1,474 | - |
RFQ |
ورقة البيانات |
Tape & Reel (TR),Cut Tape (CT) | 8400 | Active | PLCC | 68 (4 x 17) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled |
|
8452-11B1-RK-TPCONN SOCKET PLCC 52POS TIN 3M |
3,723 | - |
RFQ |
ورقة البيانات |
Tube | 8400 | Active | PLCC | 52 (4 x 13) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled |
|
214-44-320-01-670800CONN IC DIP SOCKET 20POS TIN Mill-Max Manufacturing Corp. |
1,268 | - |
RFQ |
ورقة البيانات |
Tube | 214 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
110-87-628-41-001151CONN IC DIP SOCKET 28POS GOLD Preci-Dip |
1,218 | - |
RFQ |
Tube | 110 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame, No Center Bar | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
|
AR 14-HZL/07-TTCONN IC DIP SOCKET 14POS GOLD Assmann WSW Components |
3,145 | - |
RFQ |
ورقة البيانات |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
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