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مقابس الدوائر المتكاملة والترانزستورات
| الصورة: | رقم جزء الشركة المصنعة | حالة المخزون | السعر | الكمية | ورقة البيانات | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
110-44-628-41-001000CONN IC DIP SOCKET 28POS TIN Mill-Max Manufacturing Corp. |
4,162 | - |
RFQ |
ورقة البيانات |
Tube | 110 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
8428-11B1-RK-TPCONN SOCKET PLCC 28POS TIN 3M |
2,227 | - |
RFQ |
ورقة البيانات |
Tube | 8400 | Active | PLCC | 28 (4 x 7) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled |
|
SA406000CONN IC DIP SOCKET 40POS GOLD On Shore Technology Inc. |
1,973 | - |
RFQ |
ورقة البيانات |
Tube | SA | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Thermoplastic, Polyester, Glass Filled |
|
940-44-020-17-400000CONN SOCKET PLCC 20POS TIN Mill-Max Manufacturing Corp. |
5,044 | - |
RFQ |
ورقة البيانات |
Tube | 940 | Active | PLCC | 20 (4 x 5) | 0.050 (1.27mm) | Tin | 150.0µin (3.81µm) | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
110-41-318-41-001000CONN IC DIP SOCKET 18POS GOLD Mill-Max Manufacturing Corp. |
3,040 | - |
RFQ |
ورقة البيانات |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
69802-444LFCONN SOCKET PLCC 44POS TINLEAD Amphenol ICC (FCI) |
2,067 | - |
RFQ |
ورقة البيانات |
Tape & Reel (TR),Cut Tape (CT) | 69802 | Active | PLCC | 44 (4 x 11) | 0.050 (1.27mm) | Tin-Lead | 150.0µin (3.81µm) | Phosphor Bronze | Surface Mount | Open Frame | Solder | 0.050 (1.27mm) | Tin-Lead | 150.0µin (3.81µm) | Phosphor Bronze | Polyphenylene Sulfide (PPS), Glass Filled |
|
917-43-103-41-005000CONN TRANSIST TO-5 3POS GOLD Mill-Max Manufacturing Corp. |
3,495 | - |
RFQ |
ورقة البيانات |
Tube | 917 | Active | Transistor, TO-5 | 3 (Round) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
917-93-103-41-005000CONN TRANSIST TO-5 3POS GOLD Mill-Max Manufacturing Corp. |
1,170 | - |
RFQ |
ورقة البيانات |
Tube | 917 | Active | Transistor, TO-5 | 3 (Round) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
D01-9972042CONN SOCKET SIP 20POS GOLD Harwin Inc. |
5,816 | - |
RFQ |
ورقة البيانات |
Tube | D01-997 | Active | SIP | 20 (1 x 20) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
|
115-43-314-41-003000CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp. |
6,643 | - |
RFQ |
ورقة البيانات |
Tube | 115 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
8432-11B1-RK-TPCONN SOCKET PLCC 32POS TIN 3M |
3,264 | - |
RFQ |
ورقة البيانات |
Tube | 8400 | Active | PLCC | 32 (2 x 7, 2 x 9) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled |
|
16-3518-10CONN IC DIP SOCKET 16POS GOLD Aries Electronics |
3,827 | - |
RFQ |
ورقة البيانات |
Bulk | 518 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
917-43-103-41-001000CONN TRANSIST TO-5 3POS GOLD Mill-Max Manufacturing Corp. |
2,933 | - |
RFQ |
ورقة البيانات |
Tube | 917 | Active | Transistor, TO-5 | 3 (Round) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Closed Frame | Solder | - | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
8432-21B1-RK-TPCONN SOCKET PLCC 32POS TIN 3M |
1,123 | - |
RFQ |
ورقة البيانات |
Tube | 8400 | Active | PLCC | 32 (2 x 7, 2 x 9) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled |
|
D2899-42CONN IC DIP SOCKET 3POS GOLD Harwin Inc. |
1,566 | - |
RFQ |
ورقة البيانات |
Bulk | D2 | Active | DIP, 0.3 (7.62mm) Row Spacing | 3 (1 x 3), 2 Loaded | 0.200 (5.08mm) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.200 (5.08mm) | Tin | 196.9µin (5.00µm) | Brass | Polyamide (PA), Nylon, Glass Filled |
|
110-41-320-41-001000CONN IC DIP SOCKET 20POS GOLD Mill-Max Manufacturing Corp. |
1,194 | - |
RFQ |
ورقة البيانات |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
4606CONN TRANSIST TO-3 3POS TIN Keystone Electronics |
1,424 | - |
RFQ |
ورقة البيانات |
Bulk | - | Active | Transistor, TO-3 | 3 (Rectangular) | - | Tin | - | Brass | Chassis Mount | Closed Frame | Solder | - | Tin | - | Brass | Polyester, Glass Filled |
|
940-44-028-17-400000CONN SOCKET PLCC 28POS TIN Mill-Max Manufacturing Corp. |
1,418 | - |
RFQ |
ورقة البيانات |
Tube | 940 | Active | PLCC | 28 (4 x 7) | 0.050 (1.27mm) | Tin | 150.0µin (3.81µm) | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
110-43-314-10-001000CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp. |
4,438 | - |
RFQ |
ورقة البيانات |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7), 4 Loaded | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
4600CONN TRANSIST TO-3 3POS TIN Keystone Electronics |
1,355 | - |
RFQ |
ورقة البيانات |
Bulk | - | Active | Transistor, TO-3 | 3 (Oval) | - | Tin | - | Brass | Chassis Mount | Closed Frame | Solder | - | Tin | - | Brass | Polyester, Glass Filled |
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